Event Recap: IEEE International Symposium on Power Line Communications and its Applications (PHOTOS)
April 24, 2017 | Peter Grimm, HV Business Development Manager
In April, I had the pleasure of attending IEEE ISPLC International Symposium on Power Line Communications and its Applications in Madrid, the impressive capital city of Spain.
ISPLC is an event that unifies the academic and industry worlds, attracting attendees interested in the development and deployment of power line communication systems.
The theme of this year’s symposium was "Smart Grid and its Industry." The conference focused on new technologies and research results for current and future power line communication systems. In line with this theme, I collaborated with our partner Power Plus Communication AG to present "MV BPL OHL Kit: Certification, Results and Impressions of First Installations," which covered the testing and certification results of Maxwell Technologies’ newest CONDIS product, Broadband Power Line Communication (BPL) for Medium-Voltage Overhead Power Lines.
Maxwell Technologies' CONDIS BPL for medium-voltage overhead power lines solution installed at a test site in Poland.
The CONDIS BPL solution consists of two BPL coupling capacitors, a rugged BPL modem with AES 128 bit encryption, and mounting accessories. The first product installations were completed at electric utilities in Germany, Poland and Spain with successful results. In Spain, the BPL solution achieved an end-to-end data transmission rate of 9.02 Mbps at a distance of 1,647 meters, a significant improvement compared to lines that use traditional PLC communication technology.
Our turnkey solution aroused considerable attention from utility customers. We look forward to establishing new partnerships and deploying the BPL solution for customers looking to upgrade their current power line systems for optimal performance and efficiency.
For more information on this solution, please contact us.
HV Business Development Manager
About this author
Peter Grimm is Maxwell Technologies’ HV business development manager for Maxwell’s CONDIS products and solutions. He is based in Rossens, Switzerland.
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