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79LV0832 EEPROM MCM, 8 Megabit
(256k x 32-bit), MCM, Low Power |
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Features
- Architecture: 256k x 32-bit
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Eight 128k x 8-bit EEPROM Die RAD-PAK® Radiation
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Hardened against natural space radiation
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Total dose hardness:
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>100 krad (Si) dependent upon space mission
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Single event effects:
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No Latchup > 120 MeV/mg/cm 2
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SEU > 90 MeV/mg/cm 2 read mode
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High endurance:
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10,000 cycles/byte, 10 year data retention
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Page Write Mode:
- 1 to 8 X 128 byte page
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Automatic programming:
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10 ms automatic Page/Byte write
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Package:
- 96 pin RAD-PAD® quad flat pack
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High Speed:
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200 and 250 ns maximum access times
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Low power dissipation
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88 mW/MHz active mode
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440 µ W standby mode
Description
Maxwell Technologies’ 79LV0832 multi-chip module (MCM)
memory features a typical 100 krad (Si) total dose tolerance,
dependent upon space mission. Using Maxwell Technologies’
patented radiation-hardened RAD-PAK® MCM packaging
technology, the 79LV0832 is the first radiation-hardened 8
megabit MCM EEPROM for space application. The 79LV0832
uses eight 1 Megabit high speed CMOS die to yield a 8 mega-bit
product. The 79LV0832 is capable of in-system electrical
Byte and Page programmability. It has a 128 X 8 byte Page
Programming function to make its erase and write operations
faster. It also features Data Polling and a Ready/Busy signal to
indicate the completion of erase and programming operations.
In the 79LV0832, hardware data protection is provided with
the RES pin, in addition to noise protection on the WE signal
and write inhibit on power on and off. Meanwhile, software
data protection is implemented using the JEDEC optional
standard algorithm. The 79LV0832 is designed for high reli-ability
in the most demanding applications.
Maxwell Technologies’ RAD-PAK® advanced technology
incorporates radiation shielding in microcircuit packages. It
eliminates box shielding while providing required lifetime in
orbit. This product is available with packaging and screening
up to Class K.
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