Rad hard Components For Space
Space Scene
Components
79LV0832 EEPROM MCM, 8 Megabit (256k x 32-bit), MCM, Low Power
Package(s) :
96-Pin RAD-PAD® Quad Flat Pack
Memory Size:
256k x 32 Bit
Voltage:
3.3V low voltage
Access Time:
200 or 250ns
Radiation Performance:
Total dose hardness >100 krad (Si), dependent upon space mission
SEL threshold > 84 MeV-cm2/mg
SEU threshold ~ 26 MeV-cm2/mg (Read Mode)
SEU saturated cross section ~ 2 x 10-12 cm2/bit (Read Mode)
SEU threshold ~ 11 MeV-cm2/mg (Write Mode)
SEU saturated cross section ~ 6 x 10-9 cm2/bit (Write Mode)
Specifications At A Glance
Architecture: 256k x 32-bit
Eight 128k x 8-bit EEPROM Die
Automatic programming:
  • 10 ms automatic Page/Byte write
High Speed:
  • 200 and 250 ns maximum access times
High endurance:
  • 10,000 cycles/byte
  • 10 year data retention

Page write mode:

  • 1 to 128 bytes
Low power dissipation
  • 88 mW/MHz Active Mode
  • 440 µW Standby Mode
 

Maxwell Technologies’ 79LV0832 multi-chip module (MCM) memory features a typical 100 krad (Si) total dose tolerance, dependent upon space mission. Using Maxwell Technologies’ patented radiation-hardened RAD-PAK® MCM packaging technology, the 79LV0832 is the first radiation-hardened 8 megabit MCM EEPROM for space application. The 79LV0832 uses eight 1 Megabit high speed CMOS die to yield a 8 mega-bit product.

The 79LV0832 is capable of in-system electrical Byte and Page programmability. It has a 128 X 8 byte Page
Programming function to make its erase and write operations faster. It also features Data Polling and a Ready/Busy signal to indicate the completion of erase and programming operations.

In the 79LV0832, hardware data protection is provided with the RES pin, in addition to noise protection on the WE signal and write inhibit on power on and off. Meanwhile, software data protection is implemented using the JEDEC optional standard algorithm. The 79LV0832 is designed for high reli-ability in the most demanding applications.


 

About RAD-PAK® Technology

Maxwell Technologies' patented RAD-PAK® packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing the required radiation shielding for a lifetime in orbit or space mission. In a GEO orbit, RAD-PAK provides greater than 100 krad (Si) radiation dose tolerance. This product is available with screening up to Class S.